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In the past decades, scholars have mainly adopted traditional dissimilar metal welding (laser welding, electron beam welding, diffusion welding, friction stir welding, surfacing welding and explosion welding, etc.) and spraying methods to obtain high-performance Ti alloy/Al alloy dissimilar metal structural materials. However, the metallurgical reaction between Ti and Al produces a variety of -intermetallic compounds (IMCs) during welding, including Ti3Al, TiAl, and TiAl3, etc., which reduces the ductility and strength of the weld and are the main reason for the formation and propagation of crack sources [7,8]. In order to suppress the formation of IMCs between Ti-Al and reduce the crack sensitivity of welded joints, an Al-Si wire was used to braze the Al alloy and Ti alloy. The results showed that a thin layer of ternary phase (Ti7Al5Si12) formed before TiAl3 due to the segregation of Si atoms near the bonding surface of the solid Ti alloy, effectively inhibiting the formation of TiAl3 [9,10]. In addition to controlling the weld pool composition by filler metal to reduce Ti-Al IMCs, reducing welding heat input and increasing weld cooling rate can also result in a thinner IMC layer at the Ti alloy/Al alloy joints. Zhang et al. [11] proposed a new method in which a layer of pure titanium mesh was placed between the Ti6Al4V and A6061 plates as an interlayer. This allows the molten aluminum alloy to have sound diffusion and wetting ability on the surface of the titanium alloy even at the lower welding heat input, ensuring sufficient strength of the brazing joint. In conclusion, no matter which welding method was used, it was an attempt to reduce the number and layer thickness of Ti-Al IMCs in order to improve the mechanical properties of the joint. In addition to the generation of various IMCs, the significant differences in thermal expansion coefficient and thermal conductivity between Ti alloy and Al alloy lead to welding residual stress and improve the crack sensitivity of the welded joints. In addition to welding, Naeimian et al. [12] studied the microstructure and mechanical properties of diffusion-bonded Al-Ti joints using Babbitt thermal spray coat as the interlayer. Charles et al. [13] used cold gas-dynamic spray to prepare and characterize titanium coatings of 3 mm thickness on Al 6063 substrate, although the number of Ti-Al IMCs can be reduced to a certain extent by spraying. However, it has some limitations and is only suitable for surface modification or preparation of Ti alloy and Al alloy dissimilar metals with a simple structure and small size. In summary, the direct joining of Ti alloy and Al alloy still faces severe challenges.
The emergence and development of Additive Manufacturing (AM) technology provide a new manufacturing method for connecting dissimilar materials (BS materials). Laser Additive Manufacturing (LAM), also known as Laser Engineered Net Shaping (LEN) or Laser Melting Deposition (LMD) is one of the encouraging additive manufacturing methods. It uses the laser as forming heat source and has the characteristics of high process applicability and forming efficiency. It breaks through the technical barrier whereby dissimilar welding and spraying methods are only suitable for thin plate structural parts, and can meet the manufacturing requirements of increasingly complex structural parts, especially large ones. The direct, gradient transition or interlayer transition fabrication of BS can be achieved by LAM. For example, Heer et al. [14] prepared SS430 and SS316 magneto-nonmagnetic bimetallic gradient structure materials using AM technology, which showed that different characteristic zones could be created in specific areas of a part by LAM technology alone, without the traditional joining steps. Onuike et al. [15] successfully produced crack-free Inconel718/Ti64 BS by LEN technology using CBL (a mixture composed of VC, Inconel 718 and Ti64) as an intermediate bonding layer. Ma et al. [16] successfully prepared TC4/TiAl bimetallic gradient structure materials by LMD technology, which reduced the difference in thermal expansion coefficient of the two materials and eliminated cracks in the deposition layers.
From the equilibrium state diagram of the Nb-Ti binary alloy (Figure 6b), it can be seen that an infinite solution between Nb and Ti can be achieved, and no IMC will be formed. When Nb was deposited on the surface of the TC4 deposition layer, Ti and Nb were thoroughly mixed in the molten pool by convection and the Marangoni effect [23]. As a result, a good metallurgical bond was formed at the TC4/Nb interface (Figure 2f), and the (Ti, Nb) solid solution with an atomic ratio of approximately 1:1 was also formed in the Nb region. Compared with the hard and brittle IMC generated by direct deposition of Ti-Al BS, the (Ti, Nb) solid solution has the characteristics of lower hardness and better plasticity, which can effectively relieve the stress concentration and reduce the crack sensitivity of the deposited layer to a certain extent. The composition analysis result of EDS point scanning in the Nb area (5 point position) was 46.76Ti-42.24Nb-8.52Al-0Si-2.48V (at%). The (Ti, Nb) solid solution of this composition (blue line in Figure 6b) has a relatively high melting point (~2000 °C) and completely transforms to the liquid phase at about 2100 °C. At lower AlSi12 deposition power, the (Ti, Nb) solid solution remained in the solid state, which effectively prevents the direct mixing of TC4 with AlSi12 and inhibited the formation of Ti-Al IMCs. At the same time, the dilution rate of the AlSi12 deposition layer was also reduced, which effectively inhibits the formation of NbAl3 and other IMCs. Different from Xu et al. [24] who used a niobium sheet to play the role of an obstacle in the laser welding process, the high melting point (Ti, Nb) solid solution formed after deposition plays a similar role to the non-melting niobium sheet.
Note that migrating ranks around the cores and nodes of a system canchange which ranks share physical resources, such as memory. Aconsequence of this is that communicators created viaMPI_Comm_split_type are invalidated by calls to AMPI_Migratethat result in migration which breaks the semantics of that communicatortype. The only valid routine to call on such communicators isMPI_Comm_free.
MPI functions usually require the user to preallocate the data buffersneeded before the functions being called. For unblocking communicationprimitives, sometimes the user would like to do lazy memory allocationuntil the data actually arrives, which gives the opportunities to writemore memory efficient programs. We provide a set of AMPI functions as anextension to the standard MPI-2 one-sided calls, where we provide asplit phase MPI_Get called AMPI_Iget. AMPI_Iget preservesthe similar semantics as MPI_Get except that no user buffer isprovided to hold incoming data. AMPI_Iget_wait will block until therequested data arrives and runtime system takes care to allocate space,do appropriate unpacking based on data type, and return.AMPI_Iget_free lets the runtime system free the resources being usedfor this get request including the data buffer. Finally,AMPI_Iget_data is the routine used to access the data. 2b1af7f3a8